High-speed, fully distributed architecture
High-performance 19.2Tbps switching (1.2Tbps/slot) capacity with up to 7.142Bpps for throughput.

Future proof your Enterprise network infrastructure
Advanced Layer 2/3 feature set includes BGP, EVPN, OSPF, VRF, and IPv6. Switching and routing is performed in the I/O modules, meeting the demands of bandwidth-intensive applications today and in the future.

Industry-leading line rate performance
Provides carrier-class high availability with industry-leading line rate performance. 10GbE/25GbE/40GbE/100GbE connectivity in a compact 8-slot chassis..

Specifications

Performance

High-speed fully distributed architecture
Provides up to 19.2Tbps switching capacity with up to
7.142Bpps for throughput; all switching and routing is performed in the I/O modules; meets the demands of bandwidth-intensive applications today and in the future.

Mounting and enclosure

Mounts in an EIA standard 19-inch rack or other equipment cabinet (hardware included); horizontal surface mounting only

Enviornment

Operating Temperature 0° C to 40° C (32° F to 104° F) up to 3.0 km (10,000 ft.)
Operating Relative Humidity 10% to 85% at 40° C (104° F) non-condensing
Non-Operating -40° C to 70° C (-40° F to 158° F) up to 4.6 km (15,000 ft.).